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拼焊车门内板冲压成形性分析.pdf

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车门 冲压 成形 分析
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2008 M(?30 )?10 ùnullúnullynull?A utomo tive Eng inee ring 2008( V o.l 30) N o. 102008204óoú ê =e a???s**SE1 ? SDá( 50705067a50605048)a?a?p V?á( 20070247013)?]6vD ] Ma? |? ?!??9?( 2006K J021)'ùbeà l? ° ù12008 M815 °,??à l? ° ù12008 M827 °b余海燕1,高云凯1, 朱文峰2( 1null同济大学汽车学院, 上海null 201804; null 2null同济大学机械学院, 上海null 201804)[K1] null n5o  ?¨??¨ óoe¥ú ê =e a??V??C¥ù5;¤“ ?J u×é???M? ?? ??????b2TV ü,ú ê =eC ? ? ?¥?1ey ^ ?ü?E ??@?¨a§e ¥ @?E ?? (bKa4? | ??? ?ü?E ??aH ??n @ ?? ?ú ê =e a???b1oM: óoe;ú ê =e; a???;??KmStam ping Form ab ility Analysis for Door Inner PanelsM ade o f Ta ilornullw elded B lanksYu H aiyan1, G ao Yunkai1 2nullCollege of M echanical Engineering, T ongji University, Shanghainull 201804[Abstract] null F irs,t the prob lem s occurred in the fo rm ing process of door inner pane ls m ade o f tailornullw e ldedblanks ( TW B ) w ith d ifferen t thickness are presented; Then the principa l stra in m easurem ent and fo rm ing safe tym arg in pred iction in de fect reg ions are conducted. The resu lts show that the m a in causes o f the crack ing and w rinknullling defects of door inner pane ls are insuffic ien t drawbead resistance and the discrepancy in m ateria l flow resistancebetw een thin and th ick sides ofTW B. F inally, suggestions are m ade that som e m easures shou ld be taken such as lonullca l adjustm en t in drawbead resistance and b lank ho ld ing force to im prove the form ability of door inner pane ls.K eywords: tailornullwelded blank; door inner pane;l stamping form ability; form ing lim it diagram-y?ú ,?q?¨ óoe¥a?[ 1 - 3] ^: ( 1)h ,q ? ; ( 2)h ^qé ; ( 3)1 3á z8ú4 V ?[ 4]bóoei¥ù5K?1¥ ^ a??? ?/?bù?V ü, óoe¥8???? ?D e¥??? ?μ?v?][ 5- 10]bD?B?eM1,? óoe¥ y? ×- ? ? |¤¥KvM??, ^? ???? ?N¥?1G b “ -,?Be?e? ^?/¥??Km ??ZEXü? ?,? óoe¥??K ? ???? kZE)? ?ù?¨ ,? ? ZLL¨¥ZE[ 11, 14]bù?V ü, ?Y ' ?e,? ? ? 'F?4¥NADDRG ?9 ?¥FLCDL2T1 ¤íb1N,ó??¨NADDRG ??9 ?; óoe¥FLC[ 15]b? ??lnull2 = 0) ?@null10 = (23null3+ 360t /25null4) ( n /0null21) ( 2)T?null101FLC:USà ¥? ; t1e ¨,mm; n1?M??· ?b?N ü ??M?( 0, null10 )_P§?BHD?àμZ_C?145null¥°L,_·§?BHD?à?Z_ `?120null¥°L,P· § wL ]?FLCbV1  ??ú ê =e¥?1?  ?D? ?? ?bV1nullú ê =e?1? ? ?? ?¨/mm y? ×¥'e ? V?,e  M_^? 3>×,V7á 3 ?, ?m2( d ) ? UE § u?y\? ?) (? 3  ?b13 %??ù5 V? |2?ZE: ( 1) ?9vE § u ?ü?E ?,'9vnull1¥′, Pnull2*aá 3¥?? _Y)M, VYV9F ?ü? ' 7 ! H ?ü?¥ZEr?;(2)9vnull3,]?? e¨Z_¥,V7h ?,?319vN)aH ?b4null2 ?( 1)ó?? ¥ú ê =e? ?????15% ,Kv¨hq132% ;?1??ù5VC1A u?B ue h ?×, C u?D u ??×bnull 926null null nullúnullynull?2008 M(?30 )?10 ù( 2)ypYV[/n @?é?ú ê =e¥ a???: A u31 ?hl ?ü?¥ ',Fv ?ü?????;B uD V ? Po? ü?? ? %Z_ahle¨μa ? eD V ?1s??M? ua ?o?ù ?M?  v¥?s; C u?D u V?¨ ?Fv ?ü?E ?, ?9vaH ?¥ZEh  ?b( 3) óoe¥??KM1 ? ?? kZE31éB?ù?b? IóD[ 1] nullB}[, y ü,?. úúóoe??? ?¥ kù?[ J].?¨;, 2003, 23 ( 2): 71 - 73.[ 5] nullf V?,??,?. óoeZ?q ? '??¥ Lù?[ J]. ??y?D, 2000, 7 ( 3): 22- 25.[ 6] null?í,?j ü, g,?.μ¨; óoe ê =e¥??? ?ùnull?[ J].?S?y?, 2006, 17 ( 11): 1188 - 1190.[ 7 ]null{Z,?í·,??,?. óoe? w??í?+?ù?[ J]. úy?, 2005, 27( 5 ): 631- 634.[ 8 ]null Scottd R. On M odeling of theW eld L in e in Fin ite E lem ent Analynullses of Tailorednullw elded B lank Form ing Operation [ D ]. K ingstonOn tario, C anada: Queennulls Un ivers ity, 2001: 15.[ 9 ] null K insey Brad, L iu Zh ihong, C ao Jian. A NovelForm ing Technologyfor T ailornullw elded B lanks[ J]. Journal ofM aterials Process ing Technullnology, 2000, 99: 145- 153.[ 10 ]null Youngmoo H eo, Youho Cho,i H eon Young K im, et a.l Characnullteristics ofW eld L ineM ovem en ts for the Deep D raw ing w ith Drawnullbeads of Tailornullw elded B lanks[ J ]. Jou rnal ofM aterials P rocessnulling T echnology, 2001, 11: 164- 169.[ 11 ] null Chan S M, C han L C, Lee T C. Ta ilornullw elded B lank s ofD ifferen tTh ickness Ratios E ffects on Form ing L im itD iagram s[ J]. JournalofM aterials Processing Technology, 2003, 132: 95- 101.[ 12 ]null Sh iM F, PickettK M. Form ab ility Issu es in th e App lication ofT ailorW elded B lank Sheets[ J]. SAE Paper 930278.[ 13 ]null S aund ers F I. Form ing of Tailor W elded B lanks [ D ]. A th ens,USA: The Oh io state un ivers ity, 1994.[ 14 ]nullyé 4,?:_. óoe??Kù?éZ[ J]. a/ ?,2006 ( 3): 19- 22.[ 15 ] null B leck W, Deng Zh ,i Papam an tellos K, et a.l A Com parativeS tudy of the Form ingnulllim it Diagram M od els for Sheet S teels [ J].Jou rnal ofM aterials Process ing T echnology, 1998, 83: 223- 230.( ¤?917:)m91?)è ? {? q, V[ Aú ??s??)è ? ???,?? qV U?)è ?4 ? ,μ? qV U?)è ? l ? èy??í ? ?,  {? qm??loMD3 p? q(m5( c)? U)Bá, ?@ !91 pb3null2 ?loMD ? ??¨? ? èy?? ?“d? 5 ?| {?é? ù?,i?“dé? 2 !9a? ? ? ¥?y _?b_?2TV ü:?loMD¥ ?÷5 ?| {?? V[?z1 ?@y??ì¥? q3 p,7 O? V[?v? q3 p¥M? ? q ? èya?)è ??? ?0èyé? ?s ¥,V7E ? ú ?? q ? èy¥  b? IóD[ 1] null?í, ??t,B;ó. ? èy Zú?ú e?“d¥ù?[ J]. úy?, 2005, 27( 2): 136- 140.[ 2] null B achm an G, NariciL, Beckenstein E. Fou rier and W aveletAnalynulls is[M ]. NewYork: Sp ringer, 2000.[ 3] null Gao L J, Jiang Z H, Dougal B A. E valu ation ofActiveH ybrid Funullel Cell/battery Pow er S ources[ J]. IEEE T ran s. A erosp. E lectron.Syst. , 2005, 41( 1 ): 348- 355.[ 4 ] null Spyk er R L, Nelm s RM . Analysis ofDoub lenulllayer C apacitors Supnullp lying Constan t Pow er Loads[ J]. IEEE T rans. Aerosp. E lectron.Syst. , 2000, 36( 4 ): 1439- 1443.[ 5 ] null Falkow sk iB J. Forw ard and Inverse Tran sform ations Betw een H aarW avelet and Arithm etic Functions [ J ]. E lectron ics Letters, 1998,34( 11 ): 1084- 1085.[ 6 ] null W ang X. M oving W indownullbased Doub le H aarW avelet T rans formfor Im age Processing[ J]. IEEE Trans. Im age Process. , 2006, 15( 9): 2771- 2779.[ 7 ]null E lnullSharkh M Y, Rahm an A, A lam M S, et a.l A Dyn am icM odelfor a S tandnullalone PEM Fu elCell Pow er P lant for Residen tialApplinullcation s[ J]. J. Pow er S ources, 2004, 138( 1 /2): 199- 204.[ 8 ] null Spyk er R L, Nelm s RM . Analysis ofDoub lenulllayer C apacitors Supnullp lying Constan t Pow er Loads[ J]. IEEE T rans. Aerosp. E lectron.Syst. , 2000, 36( 4 ): 1439- 1443.[ 9 ] null H oriba T, H ironaka K, M atsumu ra T, et a.l M anganese TypeLith ium Ion B attery for Pu re and H ybrid E lectric V eh icles[ J]. J.Pow er Sources, 2001, 135.
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